Array substrate and manufacturing method thereof, and display device

ABSTRACT

An array substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of the array substrate includes forming a source-drain metal pattern on a substrate, wherein the substrate includes a display region and a peripheral region located around the display region, the source-drain metal pattern located on the peripheral region including a plurality of metal wires; and forming a protective structure on a lateral side of each of the metal wires, wherein the protective structure contacts and covers the lateral side of each of the metal wires.

CROSS REFERENCE

The present application claims priority of Chinese Patent applicationNo. 201710431986.1 filed on Jun. 9, 2017, the content of which isincorporated in its entirety as portion of the present application byreference herein.

TECHNICAL FIELD

Embodiments of the present disclosure relate to a manufacturing methodof an array substrate, an array substrate and a display device.

BACKGROUND

With the continuous development of display technology, liquid crystaldisplay (LCD) and organic light emitting diode (OLED) have becomemainstream in the market. Liquid crystal display generally includes anarray substrate provided with a plurality of thin film transistors, anopposing substrate and a liquid crystal layer disposed between the arraysubstrate and the opposing substrate. Organic light emitting diodegenerally includes an array substrate provided with a plurality of thinfilm transistors, an opposing substrate, and an organic light emittinglayer disposed between the array substrate and the opposing substrate.

Because high-resolution display devices have a better visual effect,people's requirements for the resolution of display devices are alsoincreasing. And, with the development of wearable display devices, thedisplay devices are required to arrange more pixels on a smaller area.

SUMMARY

At least one embodiment of the present disclosure provides amanufacturing method of an array substrate, which includes: forming asource-drain metal pattern on a substrate, wherein the substratecomprises a display region and a peripheral region located around thedisplay region, the source-drain metal pattern located on the peripheralregion comprises a plurality of metal wires; and forming a protectivestructure on a lateral side of each of the metal wires, wherein theprotective structure contacts and covers the lateral side of each of themetal wires.

In some examples, forming the source-drain metal pattern on thesubstrate includes: forming a source-drain metal layer on the substrate;forming a first photoresist on a side of the source-drain metal layeraway from the substrate; forming a first photoresist pattern by exposingand developing the first photoresist using a first mask plate; andforming the source-drain metal pattern by taking the first photoresistpattern as a mask to etch the source-drain metal layer.

In some examples, forming the protective structure on the lateral sideof each of the metal wires includes: forming a protective layer coveringthe source-drain metal pattern on a side of the source-drain metalpattern away from the substrate; and patterning the protective layer byusing a second mask plate to remove the protective layer on a side ofthe metal wires away from the substrate and leave the protective layeron the lateral side of the metal wires to form the protective structure.

In some examples, the protective layer includes a second photoresist.

In some examples, the first photoresist is a positive photoresist, andthe second photoresist is a negative photoresist.

In some examples, the first photoresist is a negative photoresist, thesecond photoresist is a positive photoresist, and the second mask plateand the first mask plate are the same mask plate.

In some examples, the manufacturing method of the array substratefurther includes: forming a first electrode layer on a side of thesource-drain metal pattern and the protective structure away from thesubstrate; and patterning the first electrode layer to form a firstelectrode layer pattern and expose the metal wires and the protectivestructure.

In some examples, patterning the first electrode layer to form the firstelectrode layer pattern and expose the metal wires and the protectivestructure includes a wet etching process.

In some examples, the source-drain metal pattern comprises a first metallayer and second metal layers located on both sides of the first metallayer.

At least one embodiment of the present disclosure provides an array,which includes: a substrate; and a source-drain metal pattern, disposedon the substrate; wherein the substrate comprises a display region and aperipheral region around the display region, the source-drain metalpattern located on the peripheral region comprises a plurality of metalwires, a lateral side of each of the metal wires is provided with aprotective structure, and the protective structure contacts and coversthe lateral side of each of the metal wires.

In some examples, a material of the protective structure includesphotoresist.

In some examples, the source-drain metal pattern includes a first metallayer and second metal layers located on both sides of the first metallayer.

In some examples, the first metal layer includes at least one selectedfrom the group consisting of copper, aluminum, and silver.

In some examples, the second metal layers include titanium.

In some examples, the array substrate further includes: an anode,located on a side of the source-drain metal pattern away from thesubstrate; an organic light emitting layer, located on a side of theanode away from the substrate; and a cathode, located on a side of theorganic light emitting layer away from the substrate.

At least one embodiment of the present disclosure provides a displaydevice, including the array substrate in any one of the abovementionedexamples.

The manufacturing method of the array substrate can prevent the etchingsolution from etching the metal wires during a subsequent etchingprocess, so as to prevent the occurrence of short circuit or opencircuit on the array substrate, and then improve the yield rate of theproduct.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of embodiments ofthe present disclosure, the drawings of the embodiments will be brieflydescribed in the following, it is obvious that the drawings in thedescription are only related to some embodiments of the presentdisclosure and not limited to the present disclosure.

FIGS. 1a to 1e are schematic diagrams of steps of a manufacturing methodof an array substrate;

FIG. 2 is a flow chart of a manufacturing method of an array substrateprovided by an embodiment of the present disclosure;

FIG. 3 is a planar view of an array substrate provided by an embodimentof the present disclosure;

FIGS. 4a to 4e are schematic diagrams of steps of a manufacturing methodof an array substrate provided by an embodiment of the presentdisclosure;

FIGS. 5a to 5b are schematic diagrams of steps of a manufacturing methodof another array substrate provided by an embodiment of the presentdisclosure;

FIG. 6 is a schematic diagram of steps of a manufacturing method ofanother array substrate provided by an embodiment of the presentdisclosure; and

FIGS. 7a to 7b are schematic diagrams of steps of a manufacturing methodof another array substrate provided by an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the present disclosure apparently, the technicalsolutions of the embodiments will be described in a clearly and fullyunderstandable way in connection with the drawings related to theembodiments of the present disclosure. It is obvious that the describedembodiments are just a part but not all of the embodiments of thepresent disclosure. Based on the described embodiments herein, a personhaving ordinary skill in the art may obtain other embodiment(s), withoutany inventive work, which should be within the scope of the disclosure.

Unless otherwise defined, the technical terms or scientific terms usedherein have the same meanings as commonly understood by one of ordinaryskill in the art to which the present disclosure belongs. The terms“first,” “second,” etc., which are used in the description and theclaims of the present disclosure, are not intended to indicate anysequence, amount or importance, but distinguish various components. Theterms “comprises,” “comprising,” etc., are intended to specify that theelements or the objects stated before these terms encompass the elementsor the objects and equivalents thereof listed after these terms, but donot preclude the other elements or objects. The phrases “connect”,“connected”, etc., are not intended to define a physical connection ormechanical connection, but may include an electrical connection,directly or indirectly.

As the display device develops in a direction of high resolution, narrowframes, and high PPI (Pixel Per Inch), the line widths and line spacesof various circuits on an array substrate in a liquid crystal displaydevice or an organic light emitting display device are continuouslynarrowed, thereby easily causing short circuit and open circuit of thecircuits by impurity particles, metal remaining, and etching loss, andthen reducing the yield rate of the product. For example, in amanufacturing process of an array substrate of an active matrix organiclight emitting diode (AMOLED), an anode is usually wet etched, and theacidic etching solution thereof has severe over-etching of an exposedmetal layer below, thereby resulting in defects such as short circuitand open circuit.

FIGS. 1a to 1e are schematic diagrams of steps of a manufacturing methodof an array substrate. As illustrated in FIG. 1a , a source-drain metallayer 1100 is formed on a substrate 101, the source-drain metal layer1100 can include a first metal layer 1101 and second metal layers 1102stacked on both sides of the first metal layer 1101, photoresist 210 isformed on a side of the source-drain metal layer 1100 away from thesubstrate 101; as illustrated in FIG. 1b , the photoresist 210 isexposed and developed by using a first mask plate 210 to formphotoresist pattern 212; as illustrated in FIG. 1c , the source-drainmetal layer 1100 is etched by using the photoresist pattern 212 as amask to form a source-drain metal pattern 110, FIG. 1c illustrates thesource-drain metal pattern in a peripheral region of the substrate; asillustrated in FIG. 1d , an anode layer 1400 for forming an anode isformed on the source-drain metal pattern 110; as illustrated in FIG. 1e, the anode layer is etched and removed. As illustrated in FIG. 1e , theetching solution over-etches the first metal layer 1101 in thesource-drain metal pattern 110, thereby causing the second metal layers1102 on the etched first metal layer 1101 to float, and then be brokenand fall off. The fallen second metal layers usually has a shape of longstrip, and is extremely likely to remain in the array substrate, therebycausing short circuit in the circuit of the array substrate, and thencausing defects such as light and dark spots.

Therefore, embodiments of the present disclosure provide an arraysubstrate and a manufacturing method thereof, and a display device. Themanufacturing method of the array substrate includes forming asource-drain metal pattern on a substrate, wherein the substrateincludes a display region and a peripheral region located around thedisplay region, the source-drain metal pattern located on the peripheralregion includes a plurality of metal wires; and forming a protectivestructure on a lateral side of each of the metal wires, wherein theprotective structure contacts and covers the lateral side of each of themetal wires. Thus, upon the array substrate produced by theabovementioned manufacturing method of the array substrate beingperformed a subsequent etching process, the etching solution is blockedby the protective structure, thereby preventing the metal wires frombeing etched, preventing the occurrence of short circuit or open circuiton the array substrate, and then improving the yield rate of theproduct.

Hereinafter, the array substrate and the manufacturing method thereof,and the display device provided in the embodiments of the presentdisclosure will be described below with reference to the accompanyingdrawings.

An embodiment of the present disclosure provides a manufacturing methodof an array substrate. FIG. 2 is a manufacturing method of an arraysubstrate according to an embodiment of the present disclosure. Asillustrated in FIG. 2, the manufacturing method of the array substrateincludes steps S101-S102.

S101: forming a source-drain metal pattern on a substrate, the substrateincluding a display region and a peripheral region located around thedisplay region, the source-drain metal pattern located on the peripheralregion including a plurality of metal wires. It should be noted that,the plurality of metal wires located on the peripheral region can beutilized to be bonded with an external drive circuit. The source-drainmetal pattern located in the display region can include a sourceelectrode and a drain electrode of a thin film transistor and a dataline and so on.

For example, FIG. 3 is a planar view of an array substrate according tothe present disclosure. As illustrated in FIG. 3, the source-drain metalpattern 110 is formed on the substrate 101, the substrate 101 includesthe display region 1010 and the peripheral region 1012 located aroundthe display region 1010, the source-drain metal pattern 110 located onthe peripheral region 1012 includes the plurality of metal wires 112.

S102: forming a protective structure on a lateral side of each of themetal wires, the protective structure contacting and covering thelateral side of each of the metal wires.

In the manufacturing process of the array substrate, in order toelectrically connect leads of an external driving circuit and theplurality of metal wires in the array substrate, no insulating layer isprovided above the plurality of the metal wires (for example, a gateinsulating layer or a passivation layer or the like). Therefore, duringa subsequent process of forming and patterning other metal layers (suchas an anode), the etching solution may corrode the metal wires in theperipheral region, thereby causing defects such as short circuit andopen circuit. However, in the manufacturing method of the arraysubstrate provided by the present embodiment, because the protectivestructure formed on the lateral side of the metal wires that contactsand covers the metal wires can prevent the etching solution fromcorroding the metal wires, thereby avoiding the defects such as shortcircuit and open circuit, and then improving the yield rate of theproduct. For example, upon the metal wires being atitanium/aluminum/titanium stack structure, the manufacturing method ofthe array substrate provided by the present embodiment can prevent theetching solution from etching aluminum from the lateral side, and canprevent titanium on the etched aluminum from being broken and fallingoff due to etching of aluminum, thereby preventing the occurrence ofshort circuit. It should be noted that, both sides of a normal metalwire in a direction perpendicular to the substrate is provided with alayer having a strong corrosion resistance, for example, the metal wirecan be a titanium/aluminum/titanium laminate, and titanium has a strongcorrosion resistance; therefore, the etching solution mainly corrodesthe metal wire from a lateral side of the metal wire.

It should be noted that, the manufacturing method of the array substrateprovided by embodiments of the present disclosure can not only form theprotective structure on the lateral side of the source-drain metalpattern in the peripheral region, but also form a protective structureon a lateral side of a source-drain metal pattern in the display region,which is not limited thereto.

For example, in the manufacturing method of the array substrate providedby an example of the present embodiment, the step of forming thesource-drain metal pattern on the substrate includes: forming asource-drain metal layer on the substrate; forming a first photoresiston a side of the source-drain metal layer away from the substrate;forming a first photoresist pattern by exposing and developing the firstphotoresist using a first mask plate; and forming the source-drain metalpattern by taking the first photoresist pattern as a mask to etch thesource-drain metal layer.

For example, in the manufacturing method of the array substrate providedby an example of the present embodiment, a step of forming theprotective structure on the lateral side of each of the metal wiresincludes forming a protective layer covering the source-drain metalpattern on a side of the source-drain metal pattern away from thesubstrate; and patterning the protective layer by using a second maskplate to remove the protective layer on a side of the metal wires awayfrom the substrate and leave the protective layer on the lateral side ofthe metal wires to form the protective structure. Thus, the protectivestructure that contacts and covers the lateral side of the metal wirescan be formed by patterning the protective layer.

For example, FIGS. 4a to 4e are schematic diagrams of steps ofmanufacturing an array substrate according to the present embodiment. Itshould be noted that, the source-drain metal layer or the source-drainmetal pattern in FIGS. 4a to 4e adopts a stacked structure. The stackedstructure includes the first metal layer and the second metal layerslaminated on both sides of the first metal layer in a directionperpendicular to the substrate. Certainly, embodiments of the presentdisclosure include but are not limited thereto, and the source-drainmetal layer or the source-drain metal pattern can adopt otherstructures.

As illustrated in FIG. 4a , the source-drain metal layer 1100 is formedon the substrate 101, and the first photoresist 210 is formed on a sideof the source-drain metal layer 1100 away from the substrate 101. Thesource-drain metal layer 1100 includes the first metal layer 1101 andsecond metal layers 1102 stacked on both sides of the first metal layer1101 in the direction perpendicular to the substrate 101. A material ofthe first metal layer 1101 can include metals such as aluminum, copper,and silver, and a material of the second metal layers 1102 can includetitanium. It should be noted that, the specific structure of thesource-drain metal layer includes but is not limited thereto.

As illustrated in FIG. 4b , the first photoresist 210 is exposed anddeveloped using the first mask plate 310 to form a first photoresistpattern 212; a material of the first photoresist pattern 212 in FIG. 4bis a negative photoresist, that is, an exposed portion is left to formthe first photoresist pattern 212. Certainly, embodiments of the presentdisclosure include but are not limited thereto. The material of thefirst photoresist pattern can also be a positive photoresist.

As illustrated in FIG. 4c , the source-drain metal layer 1100 is etchedby using the first photoresist pattern 212 as a mask to form thesource-drain metal pattern 110. FIG. 4c illustrates the source-drainmetal pattern 110 in the peripheral region, that is, the metal wires 112in the peripheral region.

As illustrated in FIG. 4d , the first photoresist pattern 212 isremoved; the protective layer 1300 covering the source-drain metalpattern 110 is formed on a side of the source-drain metal pattern 110away from the substrate 101.

For example, the protective layer 1300 can be a second photoresist, thatis, a material of the protective layer 1300 can be photoresist. Thus,the patterning of the protective layer 1300 can be performed directlyusing an exposure and development process without using an etchingprocess, thereby reducing process steps and cost. Certainly, embodimentsof the present disclosure include but are not limited thereto, and theprotective layer can also not use photoresist.

As illustrated in FIG. 4e , the protective layer 1300 is patterned byusing a second mask plate 320 to remove the protective layer 1300 on theside of the metal wires 112 away from the substrate 101 and leave theprotective layer 1300 on the lateral side of the metal wires 1300 toform the protective structure 130.

For example, the protective layer 1300 in FIG. 4e includes the secondphotoresist, a material of the second photoresist is a positivephotoresist, that is, an exposed portion of the second photoresist isremoved. In this case, the second mask plate and the first mask platecan be the same mask plate, so as to reduce the number of mask plates,and then reduce the cost. Certainly, embodiments of the presentdisclosure include but are not limited thereto, and the property of thesecond photoresist can be opposite to that of the first photoresist.That is, upon the first photoresist being a positive photoresist, thesecond photoresist is a negative photoresist; or, upon the firstphotoresist being a negative photoresist, the second photoresist is apositive photoresist. In this case, the second mask plate and the firstmask plate are the same mask plate, so as to reduce the number of maskplates, and then reduce the cost. It should be noted that, upon thesecond mask plate and the first mask plate being the same mask plate,the protective layer in the display region of the substrate is notcompletely removed, and the protective layer in the display region isformed around the source-drain metal pattern (the height of thesource-drain metal pattern is higher), thereby facilitating thepolarization of the display region.

For example, the manufacturing method of the array substrate provided byan example of the present embodiment further includes forming a firstelectrode layer on a side of the source-drain metal pattern and theprotective structure away from the substrate, and patterning the firstelectrode layer to form a first electrode layer pattern and expose themetal wires and the protective structure. Thus, in a process of formingthe first electrode layer and patterning the first electrode layer toform the first electrode layer pattern, the protective structure canplay a role of protecting the metal wires, and can prevent the etchingsolution from corroding the metal wires, so as to avoid the defects suchas short circuit and open circuit, thereby improving the yield rate ofthe product.

FIGS. 5a to 5b are schematic diagrams of steps of a manufacturing methodof another array substrate according to the present embodiment. Asillustrated in FIG. 5a , a first electrode layer 1400 is formed on aside of the source-drain metal pattern 110 and the protective structure130 away from the substrate 101. As illustrated in FIG. 5b , the firstelectrode layer 1400 is patterned to form a first electrode layerpattern and expose the metal wires 112 and the protective structure 130.It should be noted that, because FIG. 5b illustrates a sectional view ofthe peripheral region (such as PAD region) of the array substrate, inorder to electrically connect leads of an external driving circuit andthe plurality of metal wires in the array substrate, the first electrodelayer above the metal wires needs to be completely removed.

For example, in the manufacturing method of the array substrate providedby an example of the present disclosure, a process of patterning thefirst electrode layer to form the first electrode layer pattern andexpose the metal wires and the protective structure includes a wetetching process. Because the wet etching process is easy to etch themetal wires, in this case, the protective structure located on thelateral side of the metal wires can prevent the etching solution fromcorroding the metal wires, so as to avoid the defects such as shortcircuit and open circuit, thereby improving the yield rate of theproduct.

For example, the manufacturing method of the array substrate provided byan example of the present embodiment further includes forming an organiclight emitting layer on a side of the first electrode layer pattern awayfrom the substrate; and forming a second electrode layer on a side ofthe organic light emitting layer away from the substrate. The firstelectrode layer pattern includes an anode, and the second electrodelayer pattern includes a cathode. FIG. 6 is a schematic diagram of stepsof a manufacturing method of an array substrate according to the presentembodiment. FIG. 6 illustrates a sectional view of a display region ofan array substrate. As illustrated in FIG. 6, the organic light emittinglayer 150 is formed on a side of the first electrode layer pattern 140away from the substrate 101; and the second electrode layer 160 isformed on the organic light emitting layer 150 away from the substrate101. The first electrode layer pattern 140 includes an anode, and thesecond electrode layer 160 includes a cathode. Thus, the array substratecan be applied to an organic light emitting diode (OLED) display device.Certainly, embodiments of the present disclosure include but are notlimited thereto, the array substrate can also be an array substrate of aliquid crystal display device, and other components and structuresthereof can refer to a usual design, which will not be repeated here.

An embodiment of the present disclosure provides a manufacturing methodof an array substrate. In the present embodiment, the protective layeris not made of photoresist. FIGS. 7a to 7b are schematic diagrams ofsteps of a manufacturing method of an array substrate according to thepresent embodiment. As illustrated in FIG. 7a , after forming theprotective layer 1300 covering the source-drain metal pattern 110 on aside of the source-drain metal pattern 110 away from the substrate 101,a third mask plate 330 is used to form a second photoresist pattern 232on a side of the protective layer 1300 away from the substrate 101. Asillustrated in FIG. 7b , the protective layer 1300 is etched by usingthe second photoresist pattern 232 as a mask to form a protectivestructure 130, and then the second photoresist pattern 232 is removed.

For example, a material of the protective layer can be selected from oneor more of silicon oxide, silicon nitride, and silicon oxynitride.

For example, the third mask plate and the first mask plate can be thesame mask plate, so as to reduce the number of mask plates and the cost.

An embodiment of the present disclosure provides an array substrate.FIG. 3 is a planar view of an array substrate according to the presentembodiment. FIG. 4e is a sectional view of an array substrate accordingto the present embodiment. FIG. 4e illustrates a cross section of aperipheral region of the array substrate. As illustrated in FIG. 3, thecross section includes a substrate 101 and a source-drain metal pattern110 located on the substrate 101. The substrate 101 includes a displayregion 1010 and a peripheral region 1012 around the display region 1010,and the source-drain metal pattern 110 in the peripheral region 1012includes a plurality of metal wires 112. As illustrated in FIG. 4e , alateral side of each of the metal wires is provided with a protectivestructure 130, and the protective structure 130 contacts and covers thelateral side of each of the metal wires 112.

In order to electrically connect leads of an external driving circuitand the plurality of metal wires in the array substrate, no insulatinglayer is provided above the plurality of the metal wires (for example, agate insulating layer or a passivation layer or the like). Therefore,during a subsequent process of forming and patterning other metal layers(such as an anode), the etching solution may corrode metal wires in theperipheral region, thereby causing defects such as short circuit andopen circuit. However, in the array substrate provided by the presentembodiment, because the protective structure formed on the lateral sideof the metal wires that contacts and covers the metal wires can preventthe etching solution from corroding the metal wires, thereby avoidingdefects such as short circuit and open circuit, and then improving theyield rate of the product. It should be noted that, both sides of anormal metal wire in a direction perpendicular to the substrate isprovided with a layer having a strong corrosion resistance, for example,the metal wire can be a titanium/aluminum/titanium laminate, andtitanium has a strong corrosion resistance; therefore, the etchingsolution mainly corrodes the metal wire from a lateral side of the metalwire.

For example, in the array substrate provided by an example of thepresent embodiment, a material of the protective structure includesphotoresist Thus, the protective structure can be formed only byexposure and development processes, thereby reducing process steps andthe cost.

For example, in the array substrate provided by an example of thepresent embodiment, the source-drain metal pattern can include one ormore of a source electrode, a drain electrode and a data line.

For example, in the array substrate provided by an example of thepresent embodiment, as illustrated in FIG. 4e , the source-drain metalpattern 110 includes a first metal layer 1101 and second metal layers1102 stacked on both sides of the first metal layer 1101 in a directionperpendicular to the substrate 101. For example, a material of the firstmetal layer includes one or more of copper, aluminum and silver; amaterial of the second metal layers includes titanium.

For example, FIG. 6 is a sectional view of an array substrate accordingto the present embodiment. FIG. 6 illustrates a sectional view of adisplay region of the array substrate. The array substrate furtherincludes an anode 140, an organic light emitting layer 150 and a cathode160. The anode 140 is located on a side of the source-drain metalpattern 110 away from the substrate 101; the organic light emittinglayer 150 is located on a side of the anode 140 away from the substrate101; the cathode 160 is located on a side of the organic light emittinglayer 150 away from the substrate 101. Thus, the array substrate can beapplied to an organic light emitting diode (OLED) display device.Certainly, embodiments of the present disclosure include but are notlimited thereto, the array substrate can also be an array substrate of aliquid crystal display device, other components and structures thereofcan refer to a usual design, which will not be repeated here.

An embodiment of the present disclosure provides a display device, whichincludes the array substrate described in any example of theabovementioned embodiments. Therefore, the display device has abeneficial effect corresponding to the beneficial effect of the arraysubstrate included therewith. For example, the display device caneffectively avoid short circuit, open circuit, and other defects byproviding a protective structure on both sides of the metal wires,thereby having a high yield rate.

For example, the display device can be any electronic product having adisplay function such as a computer, a television, a notebook computer,a tablet computer, a navigator, or the like. In addition, the displaydevice can also be a wearable smart device.

The following points should to be explained:

1) The drawings of at least one embodiment of the present disclosureonly relate to the structure in the embodiment of the presentdisclosure, and other structures may be referenced to the usual design.

2) In the absence of conflict, the features of the same embodiment andthe different embodiments can be combined with each other.

The above are only specific implementations of the present disclosure,however the scope of the present disclosure is not limited thereto,variations or substitutions that easily occur to any one skilled in theart within the technical scope disclosed in the present disclosureshould be encompassed in the scope of the present disclosure. Therefore,the scope of the present disclosure should be based on the scope of theclaims.

1. A manufacturing method of an array substrate, comprising: forming asource-drain metal pattern on a substrate, wherein the substratecomprises a display region and a peripheral region located around thedisplay region, the source-drain metal pattern located on the peripheralregion comprises a plurality of metal wires; and forming a protectivestructure on a lateral side of each of the metal wires, wherein theprotective structure contacts and covers the lateral side of each of themetal wires.
 2. The manufacturing method of the array substrateaccording to claim 1, wherein forming the source-drain metal pattern onthe substrate comprises: forming a source-drain metal layer on thesubstrate; forming a first photoresist on a side of the source-drainmetal layer away from the substrate; forming a first photoresist patternby exposing and developing the first photoresist using a first maskplate; and forming the source-drain metal pattern by taking the firstphotoresist pattern as a mask to etch the source-drain metal layer. 3.The manufacturing method of the array substrate according to claim 2,wherein forming the protective structure on the lateral side of each ofthe metal wires comprises: forming a protective layer covering thesource-drain metal pattern on a side of the source-drain metal patternaway from the substrate; and patterning the protective layer by using asecond mask plate to remove the protective layer on a side of the metalwires away from the substrate and leave the protective layer on thelateral side of the metal wires to form the protective structure.
 4. Themanufacturing method of the array substrate according to claim 3,wherein the protective layer comprises a second photoresist.
 5. Themanufacturing method of the array substrate according to claim 4,wherein the first photoresist is a positive photoresist, and the secondphotoresist is a negative photoresist.
 6. The manufacturing method ofthe array substrate according to claim 4, wherein the first photoresistis a negative photoresist, the second photoresist is a positivephotoresist, and the second mask plate and the first mask plate are asame mask plate.
 7. The manufacturing method of the array substrateaccording to claim 1, further comprising: forming a first electrodelayer on a side of the source-drain metal pattern and the protectivestructure away from the substrate; and patterning the first electrodelayer to form a first electrode layer pattern and expose the metal wiresand the protective structure.
 8. The manufacturing method of the arraysubstrate according to claim 7, wherein patterning the first electrodelayer to form the first electrode layer pattern and expose the metalwires and the protective structure comprises a wet etching process. 9.The manufacturing method of the array substrate according to claim 1,wherein the source-drain metal pattern comprises a first metal layer andsecond metal layers located on both sides of the first metal layer. 10.An array substrate, comprising: a substrate; and a source-drain metalpattern, disposed on the substrate; wherein the substrate comprises adisplay region and a peripheral region around the display region, thesource-drain metal pattern located on the peripheral region comprises aplurality of metal wires, a lateral side of each of the metal wires isprovided with a protective structure, and the protective structurecontacts and covers the lateral side of each of the metal wires.
 11. Thearray substrate according to claim 10, wherein a material of theprotective structure comprises photoresist.
 12. The array substrateaccording to claim 10, wherein the source-drain metal pattern comprisesa first metal layer and second metal layers located on both sides of thefirst metal layer.
 13. The array substrate according to claim 12,wherein the first metal layer comprises at least one selected from thegroup consisting of copper, aluminum, and silkier.
 14. The arraysubstrate according to claim 12, wherein the second metal layerscomprises titanium.
 15. The array substrate according to claim 10,further comprising: an anode, located on a side of the source-drainmetal pattern away from the substrate; an organic light emitting layer,located on a side of the anode away from the substrate; and a cathode,located on a side of the organic light emitting layer away from thesubstrate.
 16. A display device, comprising the array substrateaccording to claim 10.